Bascom Hunter offers turnkey solutions for prototype and low-to-mid volume manufacturing PCB assemblies. We specialize in manual and automated builds of Surface Mount (SMT) and Ball-Grid-Array (BGA) Assemblies with capabilities of installation of components as small as 0201 (008004). Each assembly is stencil free, fully traceable, and highly accurate.
Bascom Hunter offers state of the art electrical and environmental testing for components and microwave electronics. We have also developed automated electrical testing for Interference Excision Systems and other RF devices. The current focus of our testing includes the capability of digitizing analog signals with state-of-the-art direct sampling RFSoCs then combining other digital signals of interest and interferers in the digital domain using the IEEE-ISTO 4900-2021 Digital IF Standard. A standardized set of Figures-Of-Merit are used to allow for comparison of various off-the-shelf vendor devices.
Bascom Hunter packages its Photonic Integrated Circuits (PICs) including the PIC carrier design, wire bonding and optical coupling. Over the last decade Bascom Hunter has developed state-of-the-art in-house packaging capabilities specifically for high-speed electronic integrated circuits and photonic integrated circuits. These capabilities include 20+ GHz RF I/O, 100s of DC electrical I/O, and up to 16 low loss fixed optical I/O (each optical I/O can support up to 100 optical carriers). We provide electrical wire bonding, edge and vertical optical coupling, multi-chip module integration and MMIC packaging.